BERGQUIST GAP PAD TGP HC5000,Formerly known as GAPPAD HC 5.0
Highly Conformable, Thermally Conductive, Low-ModulusMaterial
Features and Benefits
• Thermal conductivity: 5.0 W/m-K
• High-compliance, low compression stress
• Fiberglass reinforced for shear and
tear resistance
BERGQUIST GAP PAD TGP HC5000 is a soft and compliantgap filling material with a thermal conductivity of 5.0 W/m-K.Thematerial offers exceptional thermal performance at lowpressures due to a unique filler package and low-modulusresin formulation. The enhanced material is ideal forapplications re low stress on components and boards duringassembly.
BERGQUIST GAP PAD TGP HC5000 maintains a conformablenature that allows for excellent interfacing and wet-outcharacteristics, even to surfaces with high roughness and/ortopography.
BERGQUIST GAP PAD TGP HC5000 is offered with naturalinherent tack on both sides of the material, eliminating the needfor thermally-impeding adhesive layers.
The top side has minimal tack for ease of handling.BERGQUIST GAP PAD TGP HC5000 is supplied withprotective liners on both sides.
BERGQUIST GPHC5.0Typical Applications Include:
• Telecommunications
• ASICs and DSPs
• Consumer electronics
• Thermal modules to heat sinks
Configurations Available:
• Sheet form and die-cut parts