BERGQUIST SIL PAD TSP 1600S Formerly known asSIL PAD 900S
High Performance Insulator for Low-Pressure Applications
Features and Benefits
• Thermal impedance: 0.61°C-in. 2 /W
(at 50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface
material solution
The true workhorse of the SIL PAD product family,BERGQUIST SIL PAD TSP 1600S thermally conductive
insulation material is designed for a wide variety ofapplications requiring high thermal performance and electrical
isolation. These applications also typically have lowmounting pressures for component clamping.
BERGQUIST SIL PAD TSP 1600S material combines asmooth and highly compliant surface characteristic with highthermal conductivity. These features optimize thethermal resistance properties at low pressures.
BERGQUIST SP900S Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts and roll form
• With or without pressure sensitive adhesive