BERGQUIST HI-FLOW THF 1600P，HI-FLOW 300P

BERGQUIST  HI-FLOW THF 1600P  Formerly known asHI-FLOW 300P

Electrically Insulating, Thermally Conductive Phase ChangeMaterial

Features and Benefits

• Thermal impedance: 0.13°C-in. 2 /W

(at 25 psi)

• Field-proven polyimide film; excellent

dielectric performance; excellent cut-

through resistance

• Outstanding thermal performance in an

insulated pad

BERGQUIST  HF300P consists  of a thermally conductive55°C phase  change compound coated on a thermally conductive polyimide film. The polyimide  reinforcement makesthe material easy to handle and the 55°C phase change temperatureminimizes shipping and  handling problems.

BERGQUIST  HI-FLOW 300P achieves outstanding values involtage breakdown and thermal performance. The product is suppliedon an easy release liner for exceptional handling in high volumemanual assemblies. BERGQUIST 

HI-FLOW THF 1600P is designed for use as a thermal interfacematerial between electronic power devices requiring

electrical isolation to the heat sink.

Typical Applications Include:

• Spring or clip-mounted

• Discrete power semiconductors and modules

Configurations Available:

• Roll form, die-cut parts and sheet form, dry both sides