BERGQUIST HI-FLOW THF 1600P Formerly known asHI-FLOW 300P
Electrically Insulating, Thermally Conductive Phase ChangeMaterial
Features and Benefits
• Thermal impedance: 0.13°C-in. 2 /W
(at 25 psi)
• Field-proven polyimide film; excellent
dielectric performance; excellent cut-
through resistance
• Outstanding thermal performance in an
insulated pad
BERGQUIST HF300P consists of a thermally conductive55°C phase change compound coated on a thermally conductive polyimide film. The polyimide reinforcement makesthe material easy to handle and the 55°C phase change temperatureminimizes shipping and handling problems.
BERGQUIST HI-FLOW 300P achieves outstanding values involtage breakdown and thermal performance. The product is suppliedon an easy release liner for exceptional handling in high volumemanual assemblies. BERGQUIST
HI-FLOW THF 1600P is designed for use as a thermal interfacematerial between electronic power devices requiring
electrical isolation to the heat sink.
Typical Applications Include:
• Spring or clip-mounted
• Discrete power semiconductors and modules
Configurations Available:
• Roll form, die-cut parts and sheet form, dry both sides